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Industrial Excimer Laser Processing System | Flexible Production Line Integration & Fully Customizable Parameters
Подробная информация о продукте:
| Место происхождения: | Китай |
| Фирменное наименование: | OSMANUV |
| Сертификация: | ISO9001 |
| Номер модели: | Спецификация |
Оплата и доставка Условия:
| Количество мин заказа: | 1 комплект |
|---|---|
| Цена: | Возможен торг |
| Упаковывая детали: | Деревянная упаковка |
| Время доставки: | 30-45 дней |
| Условия оплаты: | Т/Т |
| Поставка способности: | Переговоры |
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Подробная информация |
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| Напряжение: | 220 В/380 В | Скорость конвейера: | 25 ~ 80 м/мин |
|---|---|---|---|
| Мощность главного двигателя: | 1,5 кВт | Эффективная ширина выравнивания: | 920 мм |
| Материал покрытия: | Различные материалы | Тип УФ-лампы: | Меркурий Лампа |
| Ошибка перемотки складывания: | ±0,1 мм | Тип сушки: | ИК-сушка |
Характер продукции
Industrial Excimer Laser Processing System
Flexible Production Line Integration & Fully Customizable Parameters
Product Overview
This industrial excimer laser processing system is designed for high-precision microfabrication, semiconductor annealing, and thin-film patterning. It supports full integration into automated production lines with real-time monitoring. The system features a gas-sealed excimer source with long lifetime optics and AI-assisted process control.
Production Line Composition
- Excimer laser source unit
- Beam shaping & homogenization module
- High-speed XY scanning stage or mask projection unit
- Inline substrate handling robot (customizable track width)
- Exhaust & gas management system
- Process control PC with recipe manager
Technical Parameters
| Parameter | Value Range (Standard) | Customization Option |
|---|---|---|
| Wavelength | 193 nm / 248 nm / 308 nm | Multi-wavelength switchable (custom) |
| Max pulse energy | 0.5 - 1200 mJ | Up to 2000 mJ (custom) |
| Pulse frequency | 1 - 6000 Hz | Up to 10 kHz (custom) |
| Average power | 5 - 300 W | Custom scaling available |
| Beam size (exit) | 10 × 10 mm | Rectangular beam up to 50×50 mm (custom) |
| Beam homogeneity | < ±3% (σ) | < ±1% (custom optics) |
| Production line integration | SMEMA / SECS/GEM | Custom PLC protocol (custom) |
Applications
- Silicon annealing for advanced displays (LTPS)
- MEMS & semiconductor wafer dicing
- Polymer surface activation
- Medical device micro-structuring
- Flexible PCB drilling
Customization Options
We offer full customization of wavelength selection, pulse energy, scanning field size, gas mixture, cooling method (air/water/chiller), and production line communication protocol. Customized beam delivery arms and class-1 enclosures are also available upon request.
Key Features
- > 2000 hours gas lifetime (optimized gas mixture)
- Built-in energy stabilization (real-time feedback)
- Remote diagnostics & predictive maintenance
- Low cost of ownership (LOO) with bypass gas-saving mode
- Compact modular design for quick line reconfiguration
Support and Services
- 24/7 technical support (phone/remote)
- On-site installation & production line integration
- Custom training for your engineers
- Extended warranty up to 5 years
- Gas refill & optics refurbishment program
Packing and Shipping
- Sealed in moisture-controlled, shock-dampened container
- Vacuum-sealed optics box
- Shipping via air or sea with real-time tracking
- Export crates meet ISPM-15 standard
Frequently Asked Questions
Q1: Can you customize the laser head size for a compact production line?
Yes, the laser head and beam delivery path are fully customizable to fit narrow or odd-shaped line spaces.
Q2: What is the lead time for a customized system?
Standard: 8-10 weeks; customized: 12-14 weeks including design validation.
Q3: Do you support integration with existing MES?
Yes, we provide custom SECS/GEM, OPC-UA, or Modbus interfaces.
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